RTD developed HiDANplus to combine the modular stacking
concept of IDAN with the environmental ruggedness of HiDAN. Each HiDANplus frame has an integrated tongue and groove O-ring for environmental sealing and EMI suppression, ensuring a watertight system with minimum emissions. The machined aluminum frames coupled with MIL I/O connectors add superior shock and impact resistance to your system. Each module contains one to four PC/104-based boards with a custom wiring harness and I/O connectors. In addition to the stackable PCIe, PCI, and ISA busses, module-to-module signal connections are accomplished using an internal 120-pin stackable signal raceway, which is user-configurable allowing I/O connectors to be mounted on any frame of the system. Expanding the functionality of a system is as easy as adding another module to the stack. This rugged enclosure packaging system is a solution for any of RTD’s PC/104, PC/104-Plus, PCI-104, PCI/104-Express and PCIe/104 modules.
- Custom designed systems with your choice of RTD modules
- -40 to +85C
- Sealed modular stack integrates the ruggedness of HiDAN with the modular concept of IDAN
- User selectable and configurable MIL-C-38999 I/O connectors
- Integrated EMI O-rings form a watertight design
- Connections from board-to-board or board-to-connector via stackable
- 120-pin stackable signal raceway
- Enables quick interchangeability of modules and system expansion
- Milled aluminum frames with rugged I/O connectors
- RF isolation available
- Integrated structural heat sinks and heat pipes with optional cooling fins
- High impact resistant aluminum alloy 6061, Temper-T6, clear chromate
- MIL-SPEC paint optional
- Shock-mount isolation base plate available
- Designed using MIL-STD-810 test methods
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