HiDAN Rugged Modular Enclosure System February 1, 2015 RTD Embedded TechnologiesInc — No Comments HiDAN is the ideal solution when conditions demand a system capable of performing in harsh environments. HiDAN’s design maximizes ruggedization by enhancing resistance to shock, vibration, water, and airborne particles. Just like the IDAN system, each frame is milled from a solid block of aluminum with the addition of an integrated tongue and groove O-ring for environmental sealing and EMI suppression, ensuring a watertight system with minimum emissions. The machined aluminum frames coupled with MIL I/O connectors add superior shock and impact resistance to your system. Custom designed systems with your choice of RTD modules-40 to +85CUser selectable and configurable MIL-C-38999 I/O connectorsCustom wiring harness for rugged reliabilityMounting options can be customized to your requirementsIntegrated EMI O-rings form a watertight designAll modules attach to the CPU frame and are wired together internallyMilled aluminum frames with rugged I/O connectorsIntegrated structural heat sinks and heat pipes with optional cooling finsHigh impact resistant aluminum alloy 6061, Temper-T6, clear chromateMIL-SPEC paint optionalShock-mount isolation base plate available5.117 x 6.30 x Height in inches (130 x 160 x Height in mm) About RTD Embedded TechnologiesInc RTD is a founder of the PC/104 Consortium and an ISO 9001 and AS9100 certified company. RTD designs its products to withstand -40 to +85 C operating temperatures and severe shock and vibrations which are indispensable for the most demanding industrial, aerospace, transport, and military applications. From low power to high-end performance, RTD's product offering is the broadest in the industry. RTD specializes in the research, design, and manufacturing of PC/104, PC/104-Plus, PCI-104, PCIe/104 and PCI/104-Express compliant modules and systems, addressing intelligent process control, data acquisition and processing, adaptive signal processing, video capture, telematics, wireless, fieldbus, and power supply technologies. RTD's rugged packaging and system solutions include the IDAN®, HiDAN®, HiDANplus®, and FieldPad® and are available in standard and custom designs. Add in drivers, developed software environments, and example programs, RTD provides a clear one-stop, fast development experience with long lasting support for the embedded customer. All of RTD's products are manufactured in the U.S.A. at our facility and have seen use on every continent, in many oceans, at various levels of our atmosphere, and in space. A State of the art Automated Surface Mount Assembly System using X-Ray technology for inspection of BGA components along with Humidity Controlled Environmental Chambers highlights the effort taken to ensure a quality product.