HiDANplus Rugged Modular Enclosure System February 1, 2015 RTD Embedded TechnologiesInc — No Comments RTD developed HiDANplus to combine the modular stacking concept of IDAN with the environmental ruggedness of HiDAN. Each HiDANplus frame has an integrated tongue and groove O-ring for environmental sealing and EMI suppression, ensuring a watertight system with minimum emissions. The machined aluminum frames coupled with MIL I/O connectors add superior shock and impact resistance to your system. Each module contains one to four PC/104-based boards with a custom wiring harness and I/O connectors. In addition to the stackable PCIe, PCI, and ISA busses, module-to-module signal connections are accomplished using an internal 120-pin stackable signal raceway, which is user-configurable allowing I/O connectors to be mounted on any frame of the system. Expanding the functionality of a system is as easy as adding another module to the stack. This rugged enclosure packaging system is a solution for any of RTD’s PC/104, PC/104-Plus, PCI-104, PCI/104-Express and PCIe/104 modules. Custom designed systems with your choice of RTD modules-40 to +85CSealed modular stack integrates the ruggedness of HiDAN with the modular concept of IDANUser selectable and configurable MIL-C-38999 I/O connectorsIntegrated EMI O-rings form a watertight designConnections from board-to-board or board-to-connector via stackable120-pin stackable signal racewayEnables quick interchangeability of modules and system expansionMilled aluminum frames with rugged I/O connectorsRF isolation availableIntegrated structural heat sinks and heat pipes with optional cooling finsHigh impact resistant aluminum alloy 6061, Temper-T6, clear chromateMIL-SPEC paint optionalShock-mount isolation base plate availableDesigned using MIL-STD-810 test methods About RTD Embedded TechnologiesInc RTD is a founder of the PC/104 Consortium and an ISO 9001 and AS9100 certified company. RTD designs its products to withstand -40 to +85 C operating temperatures and severe shock and vibrations which are indispensable for the most demanding industrial, aerospace, transport, and military applications. From low power to high-end performance, RTD's product offering is the broadest in the industry. RTD specializes in the research, design, and manufacturing of PC/104, PC/104-Plus, PCI-104, PCIe/104 and PCI/104-Express compliant modules and systems, addressing intelligent process control, data acquisition and processing, adaptive signal processing, video capture, telematics, wireless, fieldbus, and power supply technologies. RTD's rugged packaging and system solutions include the IDAN®, HiDAN®, HiDANplus®, and FieldPad® and are available in standard and custom designs. Add in drivers, developed software environments, and example programs, RTD provides a clear one-stop, fast development experience with long lasting support for the embedded customer. All of RTD's products are manufactured in the U.S.A. at our facility and have seen use on every continent, in many oceans, at various levels of our atmosphere, and in space. A State of the art Automated Surface Mount Assembly System using X-Ray technology for inspection of BGA components along with Humidity Controlled Environmental Chambers highlights the effort taken to ensure a quality product.